Main PCB

Specifications:

• Material: FR4, copper (high-conductivity grade)
• Board Layers: 2-layer, 4-layer, or custom multi-layer options
• Max Operating Temperature: 125°C (depending on component choice)
• Surface Finish: HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold)
• Size: Custom dimensions (e.g., 100mm x 100mm, 200mm x 150mm, etc.)
• Impedance Control: ±10% (for high-speed signals)
• Maximum Current Capacity: 1A – 30A (depending on the trace width and application)
• Trace Width: Customizable (typically between 4mil and 12mil)
• Soldering Process: Compatible with Wave Soldering, Hand Soldering, and Reflow Soldering
• Component Mounting: Through-hole, Surface-mount, or Mixed technology

The Main PCB offers exceptional ease of integration, saving significant time during installation thanks to its intuitive design and robust functionality. Engineered for maximum reliability and performance, this board ensures smooth and efficient operation for a wide range of electronic systems. Its high-quality construction and customizable features make it a perfect fit for both complex and simple applications alike.